Semiconductor Packaging Adhesive Manufacturer

Warpage, Void, Delamination?
We Solve What Others Leave Behind.

Flip chip underfill · Die attach · SiP adhesive · Optical bonding — engineered to eliminate
defects holding back your 2.5D/3D packaging yield.

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Why COFA

Your Packaging Challenges,
Our Solutions

Advanced semiconductor packaging demands tighter tolerances. These are the defects
that kill yield — and how our underfill and adhesive materials solve them.

4
Critical defect types we eliminate in your packaging process

From warpage in thin substrates to void formation during underfill dispensing, these are the defects that hold back 2.5D/3D packaging yield. COFA materials are formulated to address each one.

Warpage

CTE mismatch causes die and substrate warpage. Our low-shrinkage formulations minimize thermal stress.

Void

Trapped air during dispensing leads to reliability failure. Optimized flow and wetting properties eliminate voids.

Delamination

Thermal shock causes interface separation. High-adhesion epoxy systems ensure bond integrity across temperature cycles.

Slow Cure

Long cure times reduce throughput. Fast-cure options (80°C / 30min) accelerate your production cycle.

3
Cure Technologies
(Heat / UV / Hybrid)
11+
Formulations
1,000–70,000 cP
80°C
Minimum Cure
30 min
5+
Application Domains
Flip-Chip · HBM · Camera · Board · Optical
Product Lineup

Semiconductor Packaging Adhesive
Product Lineup

11+ flip chip underfill, die attach, and SiP adhesive formulations across three cure technologies, filterable by viscosity and application.

Filter by Viscosity
Heat Cure
Flip Chip Underfill

COFA 4100F

High-flowability underfill for fine-pitch flip-chip & HBM. Minimizes CTE mismatch stress and warpage in 2.5D/3D packages.

Low viscosity Low CTE HBM ready Low warpage
Heat Cure
Harsh Environment Underfill

COFA 4200F

Heat-resistant underfill with controlled flow for demanding environments. Prevents delamination under extreme thermal cycling.

High viscosity Heat resistant Flow control
Heat Cure
High Hardness Underfill

COFA 4300F

Balanced viscosity with high toughness. Ideal for packages requiring void-free fill and mechanical durability.

Medium viscosity Toughened Balanced
Heat Cure
Board Reinforcement

COFA 3100H

Fast cure at 80°C / 30min for board-level reinforcement. Reduces process time without compromising adhesion strength.

Low viscosity Low-temp cure Fine-pitch
Heat Cure
Board Reinforcement

COFA 3200H

High hardness board reinforcement adhesive. Strong substrate bonding with minimal voiding under thermal stress.

Medium viscosity High hardness High reliability
Heat Cure
Die Attach

COFA 5001S

Low-stress die attach adhesive. Absorbs thermal expansion mismatch to prevent warpage in thin die assemblies.

Medium viscosity Low warpage Flexible
Heat Cure
Die Attach

COFA 5002S

Low-viscosity die attach variant for ultra-low stress applications. Minimizes warpage in thin die-bonded packages.

Low viscosity Low hardness Low warpage
Filter by Viscosity
UV + Heat
Camera / Sensor Module

COFA 1001D

Dual-cure adhesive for camera and sensor modules. High toughness prevents delamination under drop and thermal shock.

High viscosity Dual cure Toughened
UV Cure
Optical Module Bonding

COFA 2001U

Low-viscosity UV-curable adhesive with excellent optical clarity. Zero voiding for precision optical assembly.

Low viscosity Optical clarity UV cure
UV Cure
Optical Module Bonding

COFA 2002U

Medium-viscosity UV-curable adhesive. Controlled flow prevents overflow in tight optical bond lines.

Medium viscosity Optical bonding UV cure
UV Cure
Thin Component Assembly

COFA 2003U

Optimized for thin and delicate structures. Uniform bond line with minimal thermal stress during UV cure.

Medium viscosity Thin assembly UV cure
Download Full Catalog (PDF)
Applications

Where Our Underfill & Adhesive Materials Work

From FCBGA flip chip underfill to SiP adhesive and camera module bonding.

Flip-Chip
Underfill

Void-free capillary underfill for fine-pitch 2.5D/3D packages

FCBGA
Underfill

Reliable FCBGA underfill for high-bandwidth memory stacks

Camera & Sensor
Modules

Drop-resistant bonding for mobile image sensors

Optical Module
Assembly

UV-cure bonding with optical clarity

Board
Reinforcement

Fast-cure reinforcement for PCB-level reliability

MCP
(Multi-Chip Package)

Die attach & underfill for multi-chip stacking

SiP
(System in Package)

Multi-function integration with reliable SiP adhesive bonding

PoP
(Package on Package)

Layer-stacked packaging with controlled underfill flow

Semiconductor packaging cleanroom production line Underfill dispensing process close-up on FCBGA package
About COFA

20+ Years of Formulation Expertise

COFA is an epoxy resin-based adhesive company focused on semiconductor and electronics packaging.

With over two decades of formulation experience, we develop adhesive materials tailored to your specific packaging process — from resin design and filler dispersion to cure optimization.

Our lineup covers flip-chip underfill, die attach, optical bonding, and board reinforcement. All formulated and produced in Korea, validated in real production environments.

Company Founded

COFA established to bring 20+ years of adhesive formulation expertise into semiconductor packaging.

R&D & Formulation

First underfill and adhesive formulations developed. Core technology platform for epoxy-based systems established.

Production Validation

Materials qualified and adopted by production clients. Full lineup of 11+ formulations completed.

2025 | Scaling Up

Expanding into global semiconductor packaging market with an extended product portfolio and customer base.

20+ Years in Epoxy Resin-Based Adhesive Formulation

Our team specializes in epoxy resin adhesive systems for semiconductor and electronics packaging. Two decades of hands-on experience in resin design, filler dispersion, cure optimization, and production-scale quality management.

Insights

From Our Team

Perspectives on semiconductor packaging, adhesive technology, and industry trends.

Flip-Chip Underfill

Advanced packaging starts at the 2nd layer. And underfill makes it possible.

Full 3D stacking with HBM and TSV remains the domain of tier-1 players like SK Hynix and Samsung. But for most semiconductor companies, the realistic entry point is 2-layer stacking with flip-chip architecture.

At this stage, flip-chip underfill becomes the critical enabler: protecting micro-bumps, distributing thermal stress, ensuring long-term reliability, and surviving repeated temperature cycles in mobile environments.

As AI moves on-device with NPUs and edge computing, mobile devices are becoming small data centers. Even 2-layer stacking significantly reduces data travel distance and latency. The competition isn't about who stacks the most transistors. It's about who can implement stacking at a realistic level and keep it stable.

Adhesive materials sit at the center of that question.

KP
Key Park
CEO, COFA
Read more
LinkedIn Posts by Key Park

AI on-device and the role of packaging materials

As NPU and edge computing push into mobile, even 2-layer stacking changes the game. Data travel distance drops, latency drops, and real performance goes up.

Key Park View on LinkedIn →

Why adhesive materials matter in advanced packaging

Connecting heterogeneous materials reliably, managing heat and stress at micro-scale, and ensuring long-term durability. This is what packaging adhesives do.

Key Park View on LinkedIn →

The semiconductor competition is shifting to materials

Moore's law is hitting physical limits. The answer is stacking, chiplets, and advanced packaging. And at the foundation of all of it is materials technology.

Key Park View on LinkedIn →
Get in Touch

Ready to Evaluate
Our Materials?

Samples, technical data, or general questions. We respond within one business day.

Email keypark@cofa.co.kr
Location F305, Smart Square, 325 Sandan-ro,
Danwon-gu, Ansan-si, Gyeonggi-do, Korea
Phone +82-10-9245-7848

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